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These defects take the form of dislocations
1 This Guide applies to BCDS used in semiconductor manufacturing facilities for supplying liquid chemicals to wafer manufacturing processes
It applies to both single-crystalline as well as multicrystalline Si wafers
Establishment of other related terminologies will follow
P04000 - SEMI P40 - Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks Revision:SEMI P40-1109 (Reapproved 1221) - Current These defects take the formThis Specification covers the mounting requirements for extreme ultraviolet lithography (EUVL) masks in select tools. This Standard details the requirements for EUVL mask mounting. The mask mount is a flat reference surface against which the mask is clamped. The specific design and material of the mask mount are not specified. The mounting requirements in this Standard apply to the EUV exposure tools. These mounting requirements may be used in other
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