G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 (Reapproved 0217) - Inactive *This Safety Guideline has the

*This Safety Guideline has the option to purchase the Current document with a redline document (Current + Redline)

SEMI M1-1014 (technical revision)

orgで入手可能となる。初版は1997年9月発行，前版は2004年7月発行。

electrical

G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 (Reapproved 0217) - Inactive *This Safety Guideline has theThe purpose of this Document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die bonding process, and also used for shipping and handling. This Standard is applicable to 450 mm wafer tape frames. This Standard documents the dimensions, characteristics, and measurement methods for 450 mm wafer tape frames. This Standard can be used as the specification sheet for tape frame upon purchasing.